By acquiring the MYDATA MY500 solder paste jet printer, one key bottleneck in the circuit board manufacturing process can be alleviated. With traditional stencil screening process, a stencil must be ordered from a machining company, usually taking 3-5 days. With a solder paste printer, a job can be programmed offline, and sent directly to the printer, producing circuit boards the same day.
Key Jet Printer Advantages
- No more ordering, cleaning and storing of stencils
- Complete traceability of ink through bar code scanned paste cartridge
- Less waste of solder paste, especially on short runs
- Extremely versatile for higher component density boards
- A perfect match for high mix low volume production runs
- On the spot and last minute revisions
- Better handling of 3D electronics where components are placed in cavities on the printed circuit board
- Optimal paste application for each joint, especially for new packages like QFN’s
- No more dipping components in flux for package on package (POP) where components are stacked
- Non contact technology means jet printing can be applied to previously screen printed boards
Common Screen Printing Issues Solved
Jet Printer Process
- The print program is sent from an offline source to the jet printer.
- The appropriate bar-coded solder paste cassette is loaded using “snap to machine” loading system. When loaded, automatic cassette calibration and temperature control ensures proper solder paste viscosity.
- The MYDATA Flowline system ensures automation of the entire assembly line once production begins.
- An operator hits the start button and printing begins.
- The print program automatically adjusts to the board stretch based on fiducials.
- Complete traceability through the entire process – barcode on solder paste cartridge and ID chip in cassette ensure the proper paste is applied within its due date.
Want to learn more about this new technology or schedule a plant tour? Contact DCA Manufacturing today at 1-800-871-7838 or online today.