IPC Standards & J-Standards

IPC & Electronics Industry Standards & Definitions

IPC Member

IPC Standards Reference Guide.

DCA Manufacturing is a member of IPC, the Association Connecting Electronics Industries. There are currently more than 3,300 member companies from all facets of electronics industries including design, printed circuit board manufacturing and electronics assembly.

DCA Manufacturing employs a Certified IPC Trainer (CIT) who is available for training for our customers and production workers. If you are interested in Certified IPC Training, please contact us online.

IPC was founded in 1957 and guides our industry through changes in standards, improvement and enhancement of training programs, protection of the environment and government relations. Click now for a file showing how various IPC standards relate to one another on the IPC Standards Tree.

As an industry resource, we are providing summary information and links to IPC and J-Standard guidelines where available. There are additional PCB design standards not listed.  Some content is published freely online, while others are available for order direct from IPC by visiting the IPC Training site.  Most of these PDF’s are 3-page samples of the whole document available from IPC.

While this is a great resource, as always, please utilize current information direct from IPC as your final guide and to verify you have the most current revision. Information presented here is for reference only, and DCA Manufacturing is not responsible for how you use this information.

IPC General Standards

Electronics Assembly Terms & Definitions

  • IPC-T-50. Terms & Definitions


  • IPC-DRM-PTH.  Through hole solder joint evaluation
  • IPC-A-610.  Acceptability of Electronics Assemblies Training and Certification Program
  • IPC-9191.  General Guidelines for Implementation of Statistical Process Control (SPC)
  • IPC-DRM-SMT.  Surface Mount Solder Joint Evaluation

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Assembly Related


  • J-STD-001.  Requirements for Soldered Electrical and Electronic Assemblies
  • IPC-HDBK-001.  Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001 B-C-D Comparisons)
  • IPC-9261. In-Process DPMO and Estimated Yield for PCAs
  • IPC-7912. End-Item DPMO for Printed Circuit Board Assemblies


  • SMC-WP-001. Surface Mount Capabililty White Paper – Soldering Capability
  • J-STD-002. Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
  • J-STD-003. Solderability Tests for Printed Boards
  • SMC-WP-005. Surface Mount Council White Paper – PWB Surface Finishes
  • IPC-TR-461. Solderability Evaluation of Thick and Thin Fused Coatings
  • IPC-TR-462. Solderability Evaluation of Printed Boards with Protective Coatings over Long Term Storage
  • IPC-TR-464. Aging for Solderability Evaluations
  • IPC-TR-465-1. Round Robin Test on Steam Ager Temperature Control Stability
  • IPC-TR-465-2. The Effect of Steam Aging Time and Temperature on Solderability Test Result
  • IPC-TR-465-3. Evaluation of Steam Aging on Alternative Finishes Round Robin Test Program Phase IIA
  • IPC-TR-466. Wetting Balance Standard Weight Comparison Test
  • IPC-TR-585. Time, Temperature and Humidity Stress of Final Board Finish Solderability


  • IPC-SM-784. Guidelines for Chip-on-Board Technology Implementation
  • IPC-MC-790. Guidelines for Multichip Module Technology Utilization

Cable & Wire Harness

  • IPC-DRM-WHA. Wire Harness & Assembly
  • IPC-WHMA-A-620. Requirements and Acceptance for Cable and Wire Harness Assemblies

Technical Roadmap

  • J-STD-012. Implementation of Flip Chip and Chip Scale Technology
  • J-STD-013. Implementation of Ball Grid Array and Other High Density Technology 
  • J-STD-026. Semiconductor Design Standard for Flip Chip Applications
  • J-STD-028. Performance Standard for Construction of Flip Chip and Chip Scale Bumps


  • IPC-0040. Optoelectronic Assembly and Packaging Technology
  • IPC-8413-1. Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
  • IPC-8497-1. Cleaning Methods and Contamination Assessment for Optical Assembly

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Assembly Support Related

  • IPC-DRM-18. Component Identification & Training Reference Guide
  • IPC-DRM-53. Introduction to Electronics Assembly
  • IPC-DW-426. Specifications for Assembly of Discrete Wiring
  • IPC-TR-581. IPC Phase 3 Controlled Atmosphere Soldering Study
  • IPC-TA-722. Technology Assessment Handbook on Soldering
  • IPC-TA-723. Technology Assessment Handbook on Surface Mounting
  • IPC-CM-770. Guidelines for Printed Board Component Mounting
  • IPC-SM-780. Component Packaging and Interconnecting with Emphasis on Surface Mounting
  • IPC-SM-785. Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
  • IPC-S-816. SMT Process Guideline and Checklist
  • IPC-AJ-820. Assembly and Joining Handbook
  • IPC-TP-1115. Selection and Implementation Strategy for a Low-Residue, No-Clean Process
  • IPC-1720. Assembly Qualification Profile
  • IPC-7093. Design and Assembly Process Implementation for Bottom Termination SMT Components
  • IPC-7094. Design and Assembly Process Implementation for Flip Chip and Die Size Components
  • IPC-7095. Design and Assembly Process Implementation for BGAs
  • IPC-7525. Stencil Design Guidelines
  • IPC-7526. Stencil and Misprinted Board Cleaning Handbook
  • IPC-7527. Requirements for Solder Paste Printing
  • IPC-7530. Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
  • IPC-7711/7721. Rework, Modification and Repair of Electronic Assemblies
  • IPC-9701.  Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
  • IPC/JEDEC-9702. Monotonic Bend Characterization of Board-Level Interconnects
  • IPC/JEDEC-9703. Mechanical Shock Test Guidelines for Solder Joint Reliability
  • IPC/JEDEC-9704. Printed Circuit Assembly Strain Gage Test Guideline
  • IPC/JEDEC-9707. Spherical Bend Test Method for Characterization of Board Level Interconnects
  • IPC-9708. Test Methods for Characterization of Printed Board Assembly Pad Cratering
  • IPC-9850. Surface Mount Placement Equipment Characterization
  • IPC-9851. Mechanical Equipment Interface Standard

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Assembly Materials Related

Including flux, solder, adhesives, coat, mask & marking.


  • J-STD-004. Requirements for Soldering Fluxes
  • IPC-HDBK-005. Guide to Solder Paste Assessment
  • J-STD-005. Requirements for Soldering Pastes
  • J-STD-006. Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications


  • J-STD-030. Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackage
  • IPC-SM-817. General Requirements for Dielectric Surface Mounting Adhesives
  • IPC-CA-821.  General Requirements for Thermally Conductive Adhesives


  • IPC-CC-830. Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies.
  • IPC-HDBK-830. Guidelines for Design Selection and Application of Conformal Coatings
  • IPC-HDBK-840. Solder Mask Handbook
  • IPC-SM-840. Qualification and Performance Specification of Permanent Solder Mask
  • IPC-4781. Qualification and Performance Specification of Permanent Semi-Permanent and Temporary Legend and/or Marking Inks

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EHS / Management Related

  • IPC-WP/TR-584. IPC White Paper and Technical Report on Halogen-Free Materials Used for Printed Circuit Boards and Assemblies
  • IPC-1065. Material Declaration Handbook
  • J-Std-609. Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
  • IPC-1071. Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing.
  • IPC-1331. Voluntary Safety Standard for Electrically Heated Process Equipment
  • IPC-1751. Generic Requirements for Declaration Process Management
  • IPC-1752.  Materials Declaration Management
  • IPC-1756. Manufacturing Process Data Management

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Printed Board / Acceptance


  • IPC-TR486. Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of InnerLayer Separations
  • IPC-A-600. Acceptability of Printed Boards
  • IPC-OI-645. Standard for Visual Optical Inspection Aids
  • IPC-ML-960. Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards
  • IPC-1601. Printed Board Handling and Storage Guidelines
  • IPC-1710. OEM Standard for Printed Board Manufacturers’ Qualification Profile
  • IPC-4761. Design Guide for Protection of Printed Board Via Structures
  • IPC-6011. Generic Performance Specification for Printed Boards
  • IPC-6012.  Qualification and Performance Specification for Rigid Printed Boards
  • IPC-6013.  Qualification and Performance Specification for Flexible Printed Boards
  • IPC-6015. Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
  • IPC-6016. Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards
  • IPC-6017. Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
  • IPC/JPCA-6801. Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
  • IPC-9151. Printed Board Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database
  • IPC-9194. Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
  • IPC-9199. Statistical Process Control (SPC) Quality Rating
  • IPC-9252. Requirements for Electrical Testing of Unpopulated Printed Boards
  • IPC-9631.  Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
  • IPC-9691. User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)


  • IPC-DR-572. Drilling Guidelines for Printed Boards
  • IPC-TA-724. Technology Assessment on Cleanrooms
  • IPC-4552.  Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
  • IPC-4553.  Specification for Immersion Silver Plating for Printed Boards
  • IPC-4554. Specification for Immersion Tin Plating for Printed Circuit Boards
  • IPC-4556. Specification for Electroless Nickel/Electroless Palladium/Immersion Gold Plating for Printed Circuit Boards


  • IPC-1730. Laminator Qualification Profile
  • IPC-4101.  Specification for Base Materials for Rigid and Multilayer Printed Boards
  • IPC-4103. Specification for Base Materials for High Speed/High Frequency Applications
  • IPC-FC-234. PSA Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits
  • IPC-4202. Flexible Base Dielectrics for Use in Flexible Printed Circuitry
  • IPC-4203. Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
  • IPC-4204. Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
  • IPC/JPCA-4104. Specification for High Density Interconnect (HDI) and Microvia Materials

Flex Foil

  • IPC-CF-152. Composite Metallic Material Specification for Printed Wiring Boards
  • IPC-1731. Strategic Raw Materials Supplier Qualification Profile
  • IPC-4562. Metal Foil for Printed Board Applications
  • IPC-4563. Resin Coated Copper Foil for Printed Boards Guideline

HDI Laminate Reinforcement

  • IPC-SG-141. Specification for Finished Fabric Woven From ‘‘S’’ Glass for Printed Boards
  • IPC-A-142. Specification for Finished Fabric Woven from Aramid for Printed Boards
  • IPC-QF-143. Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
  • IPC-1731. Strategic Raw Materials Supplier Qualification Profile
  • IPC-4110. Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
  • IPC-4121. Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
  • IPC-4130. Specification and Characterization Methods for Nonwoven ‘‘E’’ Glass Mat
  • IPC-4411. Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
  • IPC-4412. Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards

Embedded Technologies

  • IPC-2316. Design Guide for Embedded Passive Device Printed Boards
  • IPC-4811. Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
  • IPC-4821. Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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  • J-STD-020. Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
  • J-STD-027. Mechanical Outline Standard for Flip Chip and Chip Size Configurations
  • J-STD-032. Performance Standard for Ball Grid Array Balls
  • J-STD-033. Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
  • J-STD-035. Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
  • J-STD-075. Classification of Non-IC Electronic Components for Assembly Processes
  • IPC-9501. PWB Assembly Process Simulation for Evaluation of Electronic Components (Preconditioning IC Components)
  • IPC-9502. PWB Assembly Soldering Process Guideline for Electronic Components
  • IPC-9503. Moisture Sensitivity Classification for Non-IC Components
  • IPC-9504. Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
  • IPC-9591. Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
  • IPC-9592. Performance Parameters for Power Conversion Devices

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Cleaning / Cleanliness

  • IPC-CH-65. Guidelines for Cleaning of Printed Boards and Assemblies
  • IPC-TR-468. Factors Affecting Insulation Resistance Performance of Printed Boards
  • IPC-TR-476. Electrochemical Migration: Electrically. Induced Failures in Printed Wiring Assemblies
  • IPC-TR-580. Cleaning and Cleanliness Test Program Phase 1 Test Results
  • IPC-TR-582. Cleaning and Cleanliness Test Program for: Phase 3 Low Solids Fluxes and Pastes Processed in Ambiant Air
  • IPC-TR-583. An In-Depth Look At Ionic Cleanliness Testing
  • IPC-SM-839. Pre and Post Solder Mask Application Cleaning Guidelines
  • IPC-5701. Users Guide for Cleanliness of Unpopulated Printed Boards
  • IPC-5702. Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
  • IPC-5704. Cleanliness Requirements for Unpopulated Printed Boards
  • IPC-9201. Surface Insulation Resistance Handbook
  • IPC-9202. Material and Process  Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
  • IPC-9203. Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

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